项目ITEM | 能力Capacity |
内层最小线√宽/线距 inner layer line width/space(min) | 40μm/40μm |
最小内层孔距◥线 min space of hole to inner layer line | 8mil(0.2mm) |
最小绝缘层厚度 min dielectric thickness | 1.6mil(40μm) |
内层铜箔厚度 thickness of inner copper | 1/3oz、1/2oz、(12μm、17μm) |
外层底铜厚度 thickness of outerlayer base copper | 1/4~1/3oz、1/2oz1/2(9~12μm、17μm) |
完成板厚度 thickness of finished panel | 0.3-1.6mm |
总层数/软板区层数 layer nμmber | 3~8/1~2 |
多层板◤层间对准度 registration of inner layer to inner layer | ±4mil(±100μm) |
最小钻★孔孔径 mini ddrillingilli didiameter | 0.1mm |
最◣小完成孔径 min diameter of finished hole | 0.075mm |
孔位精度accuracy of hole position | ±2mil(±50μm) |
镀通孔孔径公差 tolerance of PTH diameter | ±3mil(±75μm) |
非镀通孔孔〇径公差 tolerance of NPTH diameter | ±1mil(±25μm) |
孔电镀最大纵横比 max A.R. of PTH | 10:1 |
孔壁铜厚度PTH hole copper thickness | 根据客户需♀求 |
外层图形对位精♀度image to image tolerance | ±3mil(0.075mm) |
外层最小线宽/线距outer layer line width/space(min) | 2mil/2mil(50μm/50μm) |
蚀刻公差tolerance of line width | ±0.6mil(±15μm) |
阻焊图形对位精度solder mask registration tolerance | ±3mil(75μm) |
阻焊№桥最小宽度min solder mask dam | 4mil(100μm) |
表面╱处理工艺surface treating technics | 电镀镍金(Nikle and Gold Plating)、OSP、 ENIG+OSP、NPGP+OSP、化学镍金(ENIG)、化学镍钯』金(ENIPIG) |
外形最小公差min routing dimension tolerance(edge to edge) | ±4mil(±0.1mm) |
孔对边最小∏公差min routing dimension tolerance(hole to edge) | ±5mil(0.125mm) |
最小字〓符宽度/间距min legend line width/space | 4mil/4mil(0.1mm/0.1mm) |
单线〓阻抗控制及公差impedance control and tolerance | 50?±8% |
差动阻抗控制及公差impedance control and tolerance | 100?±10%、90?±10% |
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